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BidClosedVerified details
GEM/2026/B/7681940
High temperature epoxy adhesive Part A Resin,High temperature epoxy adhesive Part B hardener
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Published
19 Jun 2026, 05:29 pm
Closes
09 Jul 2026, 04:00 pm
Pre-bid meet
—
Bid opening
09 Jul 2026, 04:30 pm
Financial details
Estimated value—
EMD amount—
ePBG %5.00%
Advisory bankState Bank of India
Evaluation methodTotal value wise evaluation
Bid validity180 days
Buyer details
MinistryMinistry of Defence
DepartmentDepartment of Defence Research & Development
OrganisationOffice Of Dg (mss)
Office***********
BoQ items (0)
Item details are not yet extracted for this tender.
Consignees (2)
| # | Consignee | Address | Qty | Delivery (days) |
|---|---|---|---|---|
| 1 | *********** | ***********HYDERABAD | 156 | 120 |
| 1 | *********** | ***********HYDERABAD | 74 | 120 |
Exemptions & flags
MSE exemption—
Startup exemption—
OEM required—
Quick facts
Bid ID9487871
Quantity230
Status1
Details fetched20 Jun 2026, 05:49 am