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BidLive · 10 days leftVerified details
GEM/2026/B/7839477
Customized Semiconductor Wafer Bonder Setup,Optical Inspection Unit With Universal Zoom Head And Ti
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Published
28 Jul 2026, 11:33 am
Closes
08 Aug 2026, 09:00 am
Pre-bid meet
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Bid opening
08 Aug 2026, 09:30 am
Financial details
Estimated value—
EMD amount—
ePBG %5.00%
Advisory bankState Bank of India
Evaluation methodTotal value wise evaluation
Bid validity180 days
Buyer details
MinistryMinistry of Defence
DepartmentDepartment of Defence Research & Development
OrganisationOffice Of Dg ( Med & Cos)
Office***********
BoQ items (0)
Item details are not yet extracted for this tender.
Consignees (2)
| # | Consignee | Address | Qty | Delivery (days) |
|---|---|---|---|---|
| 1 | *********** | ***********NORTH DELHI | 1 | 300 |
| 1 | *********** | ***********NORTH DELHI | 1 | 300 |
Exemptions & flags
MSE exemption—
Startup exemption—
OEM required—
Quick facts
Bid ID9666993
Quantity2
Status1
Details fetched28 Jul 2026, 06:29 am