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BidClosedVerified details
GEM/2026/B/7936231
Wirebond removal for BGA packaged semiconductor chips
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Published
19 Aug 2026, 02:34 pm
Closes
01 Sept 2026, 03:00 pm
Pre-bid meet
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Bid opening
01 Sept 2026, 03:30 pm
Financial details
Estimated value—
EMD amount—
ePBG %—
Advisory bank—
Evaluation methodTotal value wise evaluation
Bid validity90 days
Buyer details
MinistryMinistry of Electronics and Information Technology
DepartmentDepartment of Electronics and Information Technology
OrganisationCentre For Development Of Advanced Computing (c-dac)
OfficeThiruvananthapuram
BoQ items (0)
Item details are not yet extracted for this tender.
Consignees (1)
| # | Consignee | Address | Qty | Delivery (days) |
|---|---|---|---|---|
| 1 | Dhanya S | 695033,Purchase Department, Centre for Development of Advanced Computing, Vellayambalam | 1 | 30 |
Exemptions & flags
MSE exemption—
Startup exemption—
OEM required—
Quick facts
Bid ID9777441
Quantity1
Status1
Details fetched20 Aug 2026, 05:10 am
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