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BidLive · 9 days leftVerified details
GEM/2026/B/8000999
HEAT SINK FOR ARTIX-7 FPGA, HIGH PERFORMANCE MAXIFLOW WITH THERMAL TAPE ATTACHMENT,HEAT SINK FOR KI
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Published
05 Sept 2026, 04:00 pm
Closes
26 Sept 2026, 06:00 pm
Pre-bid meet
—
Bid opening
27 Sept 2026, 06:00 pm
Financial details
Estimated value—
EMD amount—
ePBG %—
Advisory bank—
Evaluation methodItem wise evaluation
Bid validity180 days
Buyer details
MinistryMinistry of Communications
DepartmentDepartment of Telecommunications (DOT)
OrganisationIti Limited
OfficeIti Bangalore
BoQ items (2)
| # | Item | Description | Qty | Unit |
|---|---|---|---|---|
| Schedule 1 | Heat Sink For Artix-7 Fpga, High Performance Maxiflow With Thermal Tape Attachment | 1600 | — | — |
| Schedule 2 | Heat Sink For Kintex-7 Fpga, Maxiflow Cross Cut High Performance Heat Sinks With Hardware Attachment | 800 | — | — |
Consignees (2)
| # | Consignee | Address | Qty | Delivery (days) |
|---|---|---|---|---|
| 1 | Chakrala Subramanyam | 560016,ITI Ltd Doorvaninagar | 1600 | 30 |
| 1 | Chakrala Subramanyam | 560016,ITI Ltd Doorvaninagar | 800 | 30 |
Exemptions & flags
MSE exemption—
Startup exemption—
OEM required—
Quick facts
Bid ID9851979
Quantity2400
Status1
Details fetched06 Sept 2026, 07:59 am
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